Logging in (or registering) will help the system to select questions that you need to focus on.

E6E11

What is a characteristic of DIP packaging used for integrated circuits?

Select	Answer
A	Low leakage doubly insulated package
B	Two chips in each package (Dual In Package)
C	A total of two rows of connecting pins placed on opposite sides of the package (Dual In-line Package)
D	Package mounts in a direct inverted position

---

Hamboozler: Copyright 2007 Four Batons Technology. All rights reserved.
By continuing to use this site, you are agreeing to the Privacy Policy and Terms of Service.
Contact Us